- 专利标题: ELECTROMAGNETIC RELAY
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申请号: US17012068申请日: 2020-09-04
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公开(公告)号: US20210082649A1公开(公告)日: 2021-03-18
- 发明人: Kohei OTSUKA , Ryota MINOWA , Hiroyuki IWASAKA , Hiroyuki HARIMOCHI , Shinichi OGAWA , Naoki KAWAGUCHI
- 申请人: OMRON Corporation
- 申请人地址: JP Kyoto-shi
- 专利权人: OMRON Corporation
- 当前专利权人: OMRON Corporation
- 当前专利权人地址: JP Kyoto-shi
- 优先权: JP2019-167287 20190913
- 主分类号: H01H50/18
- IPC分类号: H01H50/18 ; H01H50/14 ; H01H50/54 ; H01H50/64 ; H01H50/36
摘要:
A pair of fixed terminals each include a first plate portion and a fixed contact arranged on the first plate portion. A movable contact piece includes a pair of movable contacts arranged to face the fixed contact. An accommodating portion includes a plurality of wall portions extending in a moving direction of the movable contact piece and an accommodating space that is surrounded by the plurality of wall portions and accommodates the fixed contact and the movable contact piece. The first plate portion protrudes from one of the plurality of wall portions to an outside of the accommodating space. At least one magnet is arranged to face a wall portion different from the wall portion from which the first plate portion protrudes among the plurality of wall portions.
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