Invention Application
- Patent Title: A HIGH-PERFORMANCE MULTILAYER FILM FOR PACKAGING
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Application No.: US16763891Application Date: 2018-07-27
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Publication No.: US20200340937A1Publication Date: 2020-10-29
- Inventor: Jang-pyo PARK , Yong-won JEONG , Jae-hong KIM , Sang-hun LEE , Jeong-eun LEE , Hye-Jung CHO
- Applicant: Samsung Electronics Co., Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2ebead98
- International Application: PCT/KR2018/008575 WO 20180727
- Main IPC: G01N27/12
- IPC: G01N27/12 ; F24F11/30
Abstract:
An electronic device is disclosed. The electronic device comprises: a gas sensor having different sensitivities in temperature for each of a plurality of gases; and a processor for calculating a concentration of at least one of a plurality of gases on the basis of an output value of the gas sensor for different temperature sections.
Public/Granted literature
- US11592412B2 High-performance multilayer film for packaging Public/Granted day:2023-02-28
Information query
