A silicone resin composition useful for producing a cured product which shows high thermal shock resistance is provided. The composition contains a silicone resin containing silicon atoms selected from A1 silicon atoms and A2 silicon atoms, and A3 silicon atoms, in which the ratio of the content of the A3 silicon atoms to the total content of the A1 silicon atoms, the A2 silicon atoms, and the A3 silicon atoms is 50 mol % or more and 99 mol % or less. Side chains bonded to the silicon atoms include an alkyl group having 1 to 3 carbons and an alkoxy group having 1 or 2 carbons, and the molar ratio of alkoxy groups of alkyl groups is 5 or more to 100.