- 专利标题: SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS
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申请号: US16488752申请日: 2018-04-11
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公开(公告)号: US20200266240A1公开(公告)日: 2020-08-20
- 发明人: Shota MORISAKI , Yoshiko TAMADA , Junichi NAKASHIMA , Daisuke OYA
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Chiyoda-ku
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Chiyoda-ku
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6572358c
- 国际申请: PCT/JP2018/015198 WO 20180411
- 主分类号: H01L27/30
- IPC分类号: H01L27/30 ; H02M7/48 ; H01L27/108
摘要:
An emitter interconnection connecting the emitter of a semiconductor switching element to a negative electrode is different in one or both of length and width from an emitter interconnection connecting the emitter of a semiconductor switching element to the negative electrode. At the time of switching, an induced electromotive force is generated at a gate control wire, or at a gate pattern, or at an emitter wire, by at least one of a current flowing through a positive electrode and a current flowing through the negative electrode, so as to reduce the difference between the emitter potential of the semiconductor switching element and the emitter potential of the semiconductor switching element caused by the difference.
公开/授权文献
- US11271043B2 Semiconductor module and power conversion apparatus 公开/授权日:2022-03-08
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