A photonic chip including an integrated optoelectronic device is flip-chip mounted to a carrier. The optoelectronic device is provided with a 3D ground cage as a shield for stray EM radiation. The 3D ground cage is formed by a device ground electrode partially enclosing the optoelectronic device on a face of the chip, a carrier ground electrode disposed opposite to the device ground electrode, and a plurality of metal pillars therebetween at least partially surrounding the optoelectronic device. The optoelectronic device may be an OE converter of an integrated optical receiver. The optoelectronic device may also be an EO converter of an integrated optical transmitter.