Invention Application
- Patent Title: MULTI-WALL DEPOSITED THIN SHEET STRUCTURE
-
Application No.: US16706083Application Date: 2019-12-06
-
Publication No.: US20200248314A1Publication Date: 2020-08-06
- Inventor: William J. Brindley , Gary D. Roberge
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Main IPC: C23C24/04
- IPC: C23C24/04 ; C23C24/08 ; F01D5/28 ; B05D1/02

Abstract:
A method for forming a metallic structure having multiple layers includes providing a main tool having a main formation surface corresponding to a desired shape of a first layer of material. The method also includes depositing the first layer of material on the main formation surface using a cold-spray deposition technique. The method also includes positioning a secondary tool having a secondary formation surface in a portion of a first volume defined by a first surface of the first layer of material. The method also includes depositing a second layer of material on the secondary formation surface using the cold-spray deposition technique. The method also includes removing the secondary tool such that the first volume is positioned between the first layer of material and the second layer of material.
Public/Granted literature
- US11441227B2 Multi-wall deposited thin sheet structure Public/Granted day:2022-09-13
Information query
IPC分类: