- 专利标题： HOUSING, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SAME
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申请号： US16245451申请日： 2019-01-11
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公开(公告)号： US20200170133A1公开(公告)日： 2020-05-28
- 发明人: Kun-Hua Chen , Wei Deng , Ke-Long Wu
- 申请人： SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. , FIH (HONG KONG) LIMITED
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1a3f4525
- 主分类号： H05K5/02
- IPC分类号： H05K5/02 ; H05K5/00 ; H04M1/02
摘要：
A housing of plastic strongly bonded to a metal frame is integrally formed as the housing of an electronic device. The metal frame includes at least one plastic grabbing recess to receive portion of a plastic member, an opening of the plastic grabbing recess carries convex teeth, the convex teeth narrow the opening of the plastic grabbing recess, and the convex teeth lock portions of the plastic member.
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