发明申请
- 专利标题: PELLICLE FOR EXTREME ULTRAVIOLET LITHOGRAPHY AND METHOD OF MANUFACTURING THE SAME
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申请号: US16689221申请日: 2019-11-20
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公开(公告)号: US20200159108A1公开(公告)日: 2020-05-21
- 发明人: Seungwon LEE , Minsu Seol , Dongwook Lee , Hyeonjin Shin
- 申请人: Samsung Electronics Co., Ltd
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5487c31c
- 主分类号: G03F1/64
- IPC分类号: G03F1/64
摘要:
A pellicle for extreme ultraviolet lithography and a method of manufacturing the pellicle for extreme ultraviolet lithography are provided. The pellicle for extreme ultraviolet lithography includes a pellicle layer having a specific (or, alternatively, predetermined) thickness, a frame on an edge area of the pellicle layer and supporting the pellicle layer, and a boron implantation layer located between the pellicle layer and the frame. The boron implantation layer is spaced by a specific (or, alternatively, predetermined) distance inward from an outer periphery of the pellicle layer.
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