- 专利标题： RESIN COMPONENT, AND MOLDING METHOD AND MOLDING DEVICE FOR SAME
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申请号： US16337683申请日： 2017-09-20
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公开(公告)号： US20200031229A1公开(公告)日： 2020-01-30
- 发明人: Taiki Moriizumi , Yuuki Kami , Noboru Hirano , Toshihiro Saimura , Hajime Miyamoto , Atsushi Yusa , Kazuhiro Kawano
- 申请人： HONDA MOTOR CO., LTD.
- 优先权： JP2016-195048 20160930
- 国际申请： PCT/JP2017/033828 WO 20170920
- 主分类号： B60K37/00
- IPC分类号： B60K37/00 ; B60R21/2165
摘要：
An instrument panel (10) is formed by bonding a base material portion (20) composed of a base material M1 and a different material portion (30) composed of a different material M2. The different material portion (30) is infiltrated into the base material portion (20) and the infiltration portion (33) has a plurality of intermittent recessed portions.
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