- 专利标题: RESIN COMPOSITION FOR PLATING, AND PLATED MOLDED ARTICLE
-
申请号: US16315855申请日: 2017-07-05
-
公开(公告)号: US20190322786A1公开(公告)日: 2019-10-24
- 发明人: Takayoshi FUJIWARA , Nana MATSUMOTO
- 申请人: NIPPON A&L INC.
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: NIPPON A&L INC.
- 当前专利权人: NIPPON A&L INC.
- 当前专利权人地址: JP Osaka-shi, Osaka
- 优先权: JP2016-136315 20160708
- 国际申请: PCT/JP2017/024593 WO 20170705
- 主分类号: C08F253/00
- IPC分类号: C08F253/00 ; C08L25/12 ; C08L51/04 ; C08L69/00 ; C08F212/10 ; C08F220/44 ; C25D5/56
摘要:
To provide a resin composition for plating and a plated molded article which are excellent in impact resistance and fluidity and which satisfy plating adhesion strength, plating deposition rate and thermal cycle resistance in a well-balanced manner.A resin composition for plating, containing a polycarbonate resin (A), a graft copolymer (B) and a copolymer (C), wherein the resin composition satisfies the following conditions (1) to (5): (1) a content of the polycarbonate resin (A) is 20 to 60% by mass based on 100% by mass of a total of (A), (B) and (C); (2) the graft copolymer (B) is a graft copolymer obtained by graft polymerization of a rubbery polymer and a monomer component including an aromatic vinyl-based monomer; (3) the copolymer (C) is a copolymer obtained by polymerization of a monomer component including an aromatic vinyl-based monomer and a vinyl cyanide-based monomer; (4) a content of the rubbery polymer is 7 to 20% by mass relative to the resin composition; and (5) a content of an oligomer component is less than 1% by mass relative to the resin composition.
信息查询