Invention Application
- Patent Title: LASER POLISHING CERAMIC SURFACES OF PROCESSING COMPONENTS TO BE USED IN THE MANUFACTURING OF SEMICONDUCTOR DEVICES
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Application No.: US16359643Application Date: 2019-03-20
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Publication No.: US20190291214A1Publication Date: 2019-09-26
- Inventor: Gang Grant PENG , David W. GROECHEL , Tuochuan HUANG
- Applicant: Applied Materials, Inc.
- Main IPC: B23K26/352
- IPC: B23K26/352 ; B23K26/0622 ; H01J37/32

Abstract:
Embodiments of the present disclosure provide methods of laser assisted modification, i.e., laser polishing, of ceramic substrates, or ceramic coated substrates, to desirably reduce the surface roughness and porosity thereof. In one embodiment, a method of laser polishing a workpiece surface includes scanning at least a portion of the workpiece surface with a pulsed laser beam. The laser beam has a pulse frequency of about 50 kHz or more and a spot size of about 10 mm2 or less and the workpiece surface comprises a ceramic material.
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