发明申请
- 专利标题： Integrated Circuit with a Thermally Conductive Underfill and Methods of Forming Same
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申请号： US16390159申请日： 2019-04-22
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公开(公告)号： US20190252346A1公开(公告)日： 2019-08-15
- 发明人: Chen-Hua Yu , Tien-I Bao
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/065 ; H01L21/56
摘要：
An integrated circuit includes a substrate and at least one chip. Each chip is disposed over the substrate or the other chip. Solder bumps are disposed between the substrate and the at least one chip. An insulating film is disposed around the solder bumps and provides electrical insulation for the solder bumps except areas for interconnections. A thermally conductive underfill is disposed between the substrate, the at least one chip, and the solder bumps.
信息查询
IPC分类:
