A heat-dissipation package for use with an optical fiber includes a base, a cover, and a hollow sleeve. The base includes an upper surface, a lower surface, and a groove embedded in the upper surface, the groove having a generally U-shaped cross-sectional shape. The cover is positioned on the upper surface of the base. The sleeve includes a cylindrical inner surface and an outer surface with a first portion which has a generally U-shaped cross section and a second portion which has a generally planar cross section such that edges of the planar cross section contact an open end of the U-shaped cross section. The first portion of the outer surface of the sleeve is positioned in the groove and the second portion of the outer surface of the sleeve is in contact with the cover. The sleeve is configured to encapsulate a heat-generating section of the optical fiber.