- 专利标题: HOUSINGS FOR ELECTRONIC DEVICES
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申请号: US16278022申请日: 2019-02-15
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公开(公告)号: US20190176379A1公开(公告)日: 2019-06-13
- 发明人: Douglas Weber , Stephen P. Zadesky , Stephen Brian Lynch
- 申请人: Apple Inc.
- 主分类号: B29C45/16
- IPC分类号: B29C45/16 ; B29C45/14 ; B23K26/382 ; C23F1/00 ; B29C37/00 ; C23F1/16
摘要:
Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.
公开/授权文献
- US11077593B2 Housings for electronic devices 公开/授权日:2021-08-03
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