A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.