Invention Application

  • Patent Title: THERMAL BRIDGE-FREE ASSEMBLY
  • Application No.: US16308387
    Application Date: 2017-06-09
  • Publication No.: US20190137036A1
    Publication Date: 2019-05-09
  • Inventor: Fabrice ChopardBoris ChauvetCédric Huillet
  • Applicant: Hutchinson
  • Applicant Address: FR Paris
  • Assignee: Hutchinson
  • Current Assignee: Hutchinson
  • Current Assignee Address: FR Paris
  • Priority: FR1655389 20160610
  • International Application: PCT/FR2017/051484 WO 20170609
  • Main IPC: F17C3/02
  • IPC: F17C3/02
THERMAL BRIDGE-FREE ASSEMBLY
Abstract:
This concerns a thermal insulation system interposed between a first volume and a second volume to be thermally managed relative to the first volume, the system comprising a series of parts providing thermal bridges between them and which are: arranged on several layers along a thickness and direction passing through the first and second volumes; and/or, transversely to these directions and thicknesses, offset two by two transversely from one said layer to the adjacent layer; and/or engaged at least two by two, transversely to the direction and thickness to force a heat flow generally provided in the direction, along the thermal bridges, to change direction towards an isotherm.
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