Invention Application
- Patent Title: THIN FILM CHIP ELECTRIC COMPONENT
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Application No.: US15981622Application Date: 2018-05-16
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Publication No.: US20190088406A1Publication Date: 2019-03-21
- Inventor: Young Ji KIM , Jin Ho KU , Hyo Chan OH
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2017-0121295 20170920
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/32 ; H01F27/24

Abstract:
A thin film chip electronic component, and more particularly, a thin film power inductor includes a body including a support member including a through hole, an inner coil supported by the support member in a thickness direction, and a magnetic material sealing the support member and the inner coil; and a plurality of external electrodes disposed on an external surface of the body. The inner coil includes a coil body and first and second end portions. Each of the first and second end portions includes a connection portion extending from the coil body and a contact portion extending from the connection portion, the connection portion being a portion that changes a winding direction of the coil body, and the contact portion is directly connected to one of the plurality of external electrodes.
Information query