A cooling arrangement (1) for cooling of an apparatus (10) which in use may generate heat is disclosed. The cooling arrangement (1) comprises a first member (2), which comprises a first base (4) and a first spiral wrap (5) extending from the first base (4), and a second member (3), which comprises a second base (6) and a second spiral wrap (7) extending from the second base (6). The first spiral wrap (5) and the second spiral wrap (7) are interleaved. The first member (2) is configured to at least thermally couple the apparatus (10) thereto. At least one of the first member (2) and the second member (3) can be moved so as to result in an orbiting motion of one of the first spiral wrap (5) and the second spiral wrap (7) relatively to the other one of the first spiral wrap (5) and the second spiral wrap (7) such that a volume of fluid in at least one space between the first spiral wrap (5) and the second spiral wrap (7) progressively moves during the orbiting motion. Thereby, a flow of fluid between the first spiral wrap (5) and the second spiral wrap (7) is generated which cools the first member (2) by means of dissipation of heat generated by the apparatus (10) by way of transfer of heat from the first member (2) to the flow of fluid between the first spiral wrap (5) and the second spiral wrap (7).