- 专利标题： SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
-
申请号： US15979956申请日： 2018-05-15
-
公开(公告)号： US20180337070A1公开(公告)日： 2018-11-22
- 发明人: Byungsun Bang , Buyoung Jung , Jungbong Choi , Bong Joo Kim , Youngil Lee , Gil Hun Song , Gui Su Park , Kwang Ryul Kim , Kwang-Seop Lee , Jin Tack Yu
- 申请人： SEMES CO., LTD.
- 优先权： KR10-2017-0060917 20170517
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/02 ; B08B7/00 ; B08B3/04 ; B08B3/08 ; B08B7/04 ; C03C23/00 ; B23K26/402
摘要：
Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes removing a portion of the thin film by irradiating a laser to the substrate, and after the removing of the portion of the thin film, removing the remaining portion of the thin film by supplying a chemical to the substrate.
信息查询
IPC分类:
