Invention Application
- Patent Title: Thermally-Conductive Electromagnetic Interference (EMI) Absorbers Positioned Or Positionable Between Board Level Shields And Heat Sinks
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Application No.: US15936045Application Date: 2018-03-26
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Publication No.: US20180228063A1Publication Date: 2018-08-09
- Inventor: Paul Francis Dixon , Mohammadali Khorrami
- Applicant: Laird Technologies, Inc.
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K1/18
Abstract:
According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.
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