Invention Application
- Patent Title: LIGHT-EMITTING DIODE SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
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Application No.: US15542234Application Date: 2017-01-06
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Publication No.: US20180219123A1Publication Date: 2018-08-02
- Inventor: Long WANG , Yanzhao LI , Chieh Hsing CHUNG , Jie SUN
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Priority: CN201610245083.X 20160419
- International Application: PCT/CN2017/070450 WO 20170106
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/15

Abstract:
A light-emitting diode substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of a light-emitting diode (LED) substrate, including: disposing a supporting substrate supporting a plurality of LED units to be opposed to a receiving substrate so that a side of the supporting substrate facing the receiving substrate supports the plurality of LED units; and irradiating a side of the supporting substrate away from the receiving substrate with laser, stripping the LED units from the supporting substrate, and transferring the LED units onto the receiving substrate. The manufacturing method of the LED substrate can better transfer LED units from the supporting substrate onto the receiving substrate.
Public/Granted literature
- US10396237B2 Light-emitting diode substrate and manufacturing method thereof, and display device Public/Granted day:2019-08-27
Information query
IPC分类: