Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE
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Application No.: US15921441Application Date: 2018-03-14
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Publication No.: US20180204873A1Publication Date: 2018-07-19
- Inventor: Atsushi Okuyama
- Applicant: Sony Corporation
- Priority: JP2009-193324 20090824
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/768
Abstract:
A semiconductor device with a connection pad in a substrate, the connection pad having an exposed surface made of a metallic material that diffuses less readily into a dielectric layer than does a metal of a wiring layer connected thereto.
Public/Granted literature
- US10541265B2 Semiconductor device and method for production of semiconductor device Public/Granted day:2020-01-21
Information query
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