Invention Application
- Patent Title: ALUMINUM-GALLIUM-NITRIDE COMPOUND/GALLIUM-NITRIDE HIGH-ELECTRON-MOBILITY TRANSISTOR
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Application No.: US15580436Application Date: 2016-12-23
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Publication No.: US20180182879A1Publication Date: 2018-06-28
- Inventor: Chunjiang REN , Tangsheng CHEN
- Applicant: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 55 RESEARCH INSTITUTE
- Applicant Address: CN Nanjing
- Assignee: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 55 RESEARCH INSTITUTE
- Current Assignee: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 55 RESEARCH INSTITUTE
- Current Assignee Address: CN Nanjing
- Priority: CN201511016882.1 20151229
- International Application: PCT/CN2016/111609 WO 20161223
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/08

Abstract:
A nitride high electron mobility transistor having a strain balance of an aluminum gallium nitride insertion layer is described. The transistor sequentially includes: a substrate and a GaN buffer layer located on the substrate; an AlyGa1-yN insertion layer located on the GaN buffer layer; an AlxGa1-xN barrier layer located on the AlyGa1-yN insertion layer opposite to the GaN buffer layer; a GaN cap layer located on the AlxGa1-xN barrier layer; a “┌”-shaped source electrode and drain electrode provided in recesses formed by the removal of the GaN cap layer and some thickness of the AlxGa1-xN barrier layer; and a gate electrode located between the source electrode and the drain electrode. An AlzGa1-zN insertion layer may be further included between the AlxGa1-xN barrier layer and the GaN cap layer.
Information query
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