According to an exemplary embodiment, a surface treatment unit comprises a chamber, a process gas inlet configured to allow process gas to enter the chamber, a first and a second plasma source, and a first RF antenna inductively coupled to the first plasma source and a second RF antenna inductively coupled to the second plasma source. The first and second RF antennas are configured to simultaneously ignite a first and second plasma, and the first and second plasma sources are configured to simultaneously supply the first and second plasma to a work-piece within the chamber.