A digital micromirror device projector is provided. The digital micromirror device projector includes a digital micromirror device chip, a heat conductive member, a thermo-electric cooler unit and a thermal insulator. The heat conductive member includes a heat conductive plate and a heat conductive protrusion. The heat conductive plate includes a first surface and a second surface, wherein the first surface is opposite to the second surface. The heat conductive protrusion is formed on the first surface. The heat conductive protrusion is thermally connected to the digital micromirror device chip by conduction. The thermo-electric cooler unit includes a cool side and a hot side, wherein the cool side is connected to the second surface. The thermal insulator is attached to the first surface. The thermal insulator surrounds the heat conductive protrusion.