- 专利标题: LAMINATED BODY, MOLDED ARTICLE, ELECTROCONDUCTIVE PATTERN, ELECTRONIC CIRCUIT, AND ELECTROMAGNETIC SHIELD
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申请号: US15739599申请日: 2016-06-23
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公开(公告)号: US20180162106A1公开(公告)日: 2018-06-14
- 发明人: Wataru FUJIKAWA , Jun SHIRAKAMI , Akira MURAKAWA , Taku SHIMAYA
- 申请人: DIC Corporation
- 优先权: JP2015-128836 20150626
- 国际申请: PCT/JP2016/068661 WO 20160623
- 主分类号: B32B27/08
- IPC分类号: B32B27/08 ; B32B15/06 ; B32B15/08 ; H05K3/38 ; C23C28/00 ; B32B27/30 ; C08F265/06 ; C08L27/16
摘要:
The present invention provides a laminated body including a support (A) that includes a polyphenylene sulfide resin composition containing a polyphenylene sulfide (a1) and an elastomer (a2), and a metal layer (B) and a metal-plating layer (C) that are laminated on the support (A) in this order, wherein the elastomer (a2) is contained in the polyphenylene sulfide resin composition in an amount in the range of 0.3 to 90 parts by mass relative to 100 parts by mass of the polyphenylene sulfide (a1). The laminated body is excellent in adhesiveness between the polyphenylene sulfide as the support and the metal-plating layer, and also has a thermal resistance so as to maintain the excellent adhesiveness even when exposed to a high-temperature environment.
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