- 专利标题: LAMINATE AND PATTERN FORMING METHOD
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申请号: US15783397申请日: 2017-10-13
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公开(公告)号: US20180107116A1公开(公告)日: 2018-04-19
- 发明人: Satoshi Asai , Kyoko Soga , Hideto Kato
- 申请人: Shin-Etsu Chemical Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2016-202352 20161014
- 主分类号: G03F7/075
- IPC分类号: G03F7/075 ; G03F7/038 ; G03F7/16 ; G03F7/20 ; C08G77/38
摘要:
To provide a laminate which enables pattern formation with excellent opening shape even in the case where a chemically amplified negative type resist material is used, and a pattern forming method in which the laminate is used.The laminate includes a chemically amplified negative type resist layer, and a basic resin coat layer thereon that contains 0.001 to 10% by weight of a basic compound having a molecular weight of up to 10,000.
公开/授权文献
- US10948823B2 Laminate and pattern forming method 公开/授权日:2021-03-16
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