- 专利标题: Package-On-Package (PoP) Structure Including Stud Bulbs
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申请号: US15793325申请日: 2017-10-25
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公开(公告)号: US20180047709A1公开(公告)日: 2018-02-15
- 发明人: Chen-Hua Yu , Mirng-Ji Lii , Chung-Shi Liu , Ming-Da Cheng
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号: H01L25/065
- IPC分类号: H01L25/065 ; H01L23/498 ; H01L25/00 ; H01L23/00 ; H01L25/10
摘要:
Embodiments concern Package-On-Package (PoP) structures including stud bulbs and methods of forming PoP structures. According to an embodiment, a structure includes a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to a first surface of the first substrate. The die is attached to the first surface of the first substrate. The electrical connectors are coupled to the second substrate, and respective ones of the electrical connectors are coupled to respective ones of the stud bulbs.
公开/授权文献
- US10157893B2 Package-on-package (PoP) structure including stud bulbs 公开/授权日:2018-12-18
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