Regarding cured pattern films for semiconductor apparatuses, the present invention provides a photosensitive resin composition that is high in sensitivity and able to realize improved contact between a cured pattern film and metal wiring after a reflow process. The photosensitive resin composition includes an alkali-soluble resin which contains at least one selected from the group consisting of a resin (a-1) which contains, as primary component, a structure as represented by the undermentioned general formula (1), polyimides (a-2) and copolymers thereof, and a compound (c) which contains, as primary component, a structure as represented by the undermentioned general formula (2). (In general formula (1), R1 and R2 may be identical to or different from each other and each represent a divalent to octavalent organic group having 2 or more carbon atoms; R3 and R4 may be identical to or different from each other and each represent either a hydrogen atom or an organic group having 1 to 20 carbon atoms; n is an integer of 10 to 100,000; m and f are independently an integer of 0 to 2; p and q are independently an integer of 0 to 4; and m+q≠0 and p+q≠0.) (In general formula (2), R5, R6, and R7 may be identical to or different from each other and each represent either a hydrogen atom or a monovalent organic group having 1 or more carbon atoms, and at least one of R5, R6, and R7 is a monovalent organic group having 1 or more carbon atoms.)