Discussed generally herein are methods and devices including or providing a redistribution layer device without under ball metallization. A device can include a substrate, electrical interconnect circuitry in the substrate, redistribution layer (RDL) circuitry electrically connected to the electrical interconnect circuitry, a conductive bump electrically connected to the RDL circuitry, the conductive bump interfacing directly with the RDL circuitry, and a sheet molding material over the substrate.