Invention Application
- Patent Title: SEMICONDUCTOR DEVICES AND PROCESSING METHODS
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Application No.: US15455158Application Date: 2017-03-10
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Publication No.: US20170236801A1Publication Date: 2017-08-17
- Inventor: Michael Rogalli , Wolfgang Lehnert
- Applicant: Infineon Technologies AG
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
Various embodiments provide a semiconductor device, including a final metal layer having a top side and at least one sidewall; and a passivation layer disposed over at least part of at least one of the top side and the at least one sidewall of the final metal layer; wherein the passivation layer has a substantially uniform thickness.
Public/Granted literature
- US10103123B2 Semiconductor devices and processing methods Public/Granted day:2018-10-16
Information query
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