Invention Application
- Patent Title: Electronic Component and Method
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Application No.: US14953865Application Date: 2015-11-30
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Publication No.: US20170154831A1Publication Date: 2017-06-01
- Inventor: Martin Standing
- Applicant: Infineon Technologies Austria AG
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/768 ; H01L23/528 ; H01L21/3213 ; H01L23/00 ; H01L23/29 ; H01L21/56 ; H01L21/288 ; H01L21/02 ; H01L23/48
Abstract:
In an embodiment, an electronic component includes a first dielectric layer including an organic component having a decomposition temperature of at least 180° C., a semiconductor die embedded in the first dielectric layer, a second dielectric layer arranged on a first surface of the first dielectric layer, the second dielectric layer including a photo definable polymer composition and defining two or more discrete openings having conductive material, and a first substrate arranged on the second dielectric layer and on the conductive material. One or more contact pads are arranged on an outermost surface of the first substrate.
Public/Granted literature
- US09831147B2 Packaged semiconductor device with internal electrical connections to outer contacts Public/Granted day:2017-11-28
Information query
IPC分类:
