发明申请
- 专利标题： SEMICONDUCTOR DEVICE WITH A RESIN LAYER AND METHOD OF MANUFACTURING THE SAME
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申请号： US15253747申请日： 2016-08-31
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公开(公告)号： US20170133344A1公开(公告)日： 2017-05-11
- 发明人: Satoru TAKAKU
- 申请人： KABUSHIKI KAISHA TOSHIBA
- 优先权： JP2015-219580 20151109
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L21/66
摘要：
A semiconductor device includes a substrate, a semiconductor chip having a first surface bonded to the substrate and a second surface that is opposite to the first surface and includes a first electrode pad and a second electrode pad thereon, the first electrode pad being electrically connected to a circuit of the semiconductor chip that is operated during operation of the semiconductor device and the second electrode pad being electrically separated from the circuit, a first wire extending between the first electrode pad and a terminal of the substrate that is electrically connected with an external device during operation of the semiconductor device, a second wire extending between the second electrode pad and the substrate, and a resin layer formed over the second surface of the semiconductor chip and covering the first and second wires.
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