- 专利标题： Method and Apparatus for Use in Wafer Processing
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申请号： US14933931申请日： 2015-11-05
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公开(公告)号： US20170133253A1公开(公告)日： 2017-05-11
- 发明人: Thomas Fischer , Gerald Lackner , Walter Horst Leitgeb , Michael Lecher
- 申请人： Infineon Technologies AG
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; G01B11/27 ; H01L21/68 ; H01L21/66 ; H01L21/78
摘要：
A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.
公开/授权文献
- US10186438B2 Method and apparatus for use in wafer processing 公开/授权日：2019-01-22
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