Invention Application
- Patent Title: CHIP CARRIER, A DEVICE AND A METHOD
- Patent Title (中): 芯片载体，设备和方法
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Application No.: US15232815Application Date: 2016-08-10
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Publication No.: US20170062358A1Publication Date: 2017-03-02
- Inventor: FRANK PUESCHNER , JENS POHL
- Applicant: Infineon Technologies AG
- Priority: DE102015114645.2 20150902
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L21/48 ; H01L23/498 ; H01L23/31
Abstract:
According to various embodiments, a chip carrier may include: a chip supporting region configured to support a chip; a chip contacting region including at least one contact pad for electrically contacting the chip; wherein the chip carrier is thinned in the chip contacting region such that a first thickness of the chip carrier at the at least one contact pad is smaller than a second thickness of the chip carrier in the chip supporting region.
Public/Granted literature
- US09824983B2 Chip carrier, a device and a method Public/Granted day:2017-11-21
Information query
IPC分类:
