Invention Application
- Patent Title: SONIC DUST REMEDIATION
- Patent Title (中): SONIC污垢补救
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Application No.: US15122424Application Date: 2014-03-31
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Publication No.: US20170059263A1Publication Date: 2017-03-02
- Inventor: Yanbing Sun , Mark MacDonald , Jiancheng Tao , Ming Zhang
- Applicant: Yanbing SUN , Mark MACDONALD , Jiancheng TAO , Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- International Application: PCT/CN2014/074353 WO 20140331
- Main IPC: F28G7/00
- IPC: F28G7/00 ; F28G15/00 ; B08B7/02 ; G05B15/02 ; G06F1/20

Abstract:
A system and method are disclosed for using a sonic frequency to induce a vibration useful for clearing dust accumulation from microelectronics, such as a laptop computer. A speaker driver may be mounted onto a support structure for a heat exchanger (220). At an advantageous time, such as boot up, a sonic frequency may be driven onto the speaker (250), thus inducing vibration in the heat exchanger (220) and helping to clear dust accumulation. In some cases, a resonant frequency may be used to optimize the amount of vibration per unit power delivery.
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