Invention Application
- Patent Title: Thermosiphon Systems for Electronic Devices
- Patent Title (中): 电子设备热虹吸系统
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Application No.: US15341190Application Date: 2016-11-02
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Publication No.: US20170055377A1Publication Date: 2017-02-23
- Inventor: Jeremy Rice , Bill Dailey , Jeffrey S. Spaulding
- Applicant: Google Inc.
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A thermosiphon system includes a condenser and an evaporator fluidly coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick
Public/Granted literature
- US10225959B2 Thermosiphon systems for electronic devices Public/Granted day:2019-03-05
Information query
