Invention Application
- Patent Title: PIEZOELECTRIC MODULE
- Patent Title (中): 压电模块
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Application No.: US15230981Application Date: 2016-08-08
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Publication No.: US20170041082A1Publication Date: 2017-02-09
- Inventor: Kaoru KIJIMA , Akira SATOH
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2015-156063 20150806
- Main IPC: H04B11/00
- IPC: H04B11/00 ; H04R17/00 ; H01L41/08

Abstract:
Provided is a piezoelectric module capable of attempting further miniaturization. In the piezoelectric module, a resonance point is excluded from a frequency band of a transmitted signal to avoid shortening of a signal transmission distance, thereby attempting improvement in stability of communication. In addition, since a resonance space is not provided, further miniaturization may be easily attempted.
Public/Granted literature
- US10511389B2 Piezoelectric module Public/Granted day:2019-12-17
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