Invention Application
- Patent Title: ELECTROLESS PLATING SYSTEM INCLUDING BUBBLE GUIDE
- Patent Title (中): 电镀系统,包括泡泡指南
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Application No.: US14812140Application Date: 2015-07-29
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Publication No.: US20170029952A1Publication Date: 2017-02-02
- Inventor: Kelvin P. Hill , Robert R. Bettin , James Douglas Shifley , Timothy John Young , Gary P. Wainwright
- Applicant: Eastman Kodak Company
- Main IPC: C23C18/16
- IPC: C23C18/16

Abstract:
A roll-to-roll electroless plating system, including a plating tank containing plating solution, and a web advance system for advancing a web of media along a web-transport path that passes through the plating tank. One or more fluid guides are positioned within the plating tank to redirect plating fluid containing gas bubbles introduced by a gas bubble source away from the web of media as it is advanced through the plating solution in the plating tank.
Public/Granted literature
- US09689073B2 Electroless plating system including bubble guide Public/Granted day:2017-06-27
Information query
IPC分类: