发明申请
US20170025383A1 MULTICHIP MODULE, ON BOARD COMPUTER, SENSOR INTERFACE SUBSTRATE, AND THE MULTICHIP MODULE MANUFACTURING METHOD
审中-公开
多模块模块，板上计算机，传感器接口基板和多模块模块制造方法
- 专利标题： MULTICHIP MODULE, ON BOARD COMPUTER, SENSOR INTERFACE SUBSTRATE, AND THE MULTICHIP MODULE MANUFACTURING METHOD
- 专利标题（中）： 多模块模块，板上计算机，传感器接口基板和多模块模块制造方法
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申请号： US15124206申请日： 2015-01-28
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公开(公告)号： US20170025383A1公开(公告)日： 2017-01-26
- 发明人: Masahiro KATO , Yoshikatsu KURODA
- 申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI HEAVY INDUSTRIES, LTD
- 当前专利权人： MITSUBISHI HEAVY INDUSTRIES, LTD
- 当前专利权人地址： JP Tokyo
- 优先权： JP2014-046582 20140310
- 国际申请： PCT/JP2015/052411 WO 20150128
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L25/00 ; H01L23/48
摘要：
A multichip module includes a plurality of semiconductor substrates and a plurality of surface mounting parts. The plurality of semiconductor substrates each have a wiring line region which contains a wiring line to pierce from one of the surfaces to the other surface. A plurality of surface mounting parts are mounted on either of the plurality of surface mounting parts. The plurality of semiconductor substrates are stacked to form a multilayer structure. The first surface mounting part as at least one of the plurality of surface mounting parts is arranged in an inside region of the multilayer structure.
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