- 专利标题： LIGHT-EMITTING DIODE CHIP PACKAGE
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申请号： US15186396申请日： 2016-06-17
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公开(公告)号： US20160300821A1公开(公告)日： 2016-10-13
- 发明人: Yi-Jyun Chen , Chih-Hao Lin , Hsin-Lun Su , Fang-Chang Hsueh
- 申请人： LEXTAR ELECTRONICS CORPORATION
- 优先权： TW104105987 20150225
- 主分类号： H01L25/075
- IPC分类号： H01L25/075 ; H01L33/50 ; H01L33/44 ; H01L33/62
摘要：
A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.
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