Invention Application
- Patent Title: CURABLE SILICONE RESIN COMPOSITION
- Patent Title (中): 可固化硅树脂组合物
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Application No.: US14977053Application Date: 2015-12-21
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Publication No.: US20160185912A1Publication Date: 2016-06-30
- Inventor: Tomoyuki MIZUNASHI , Takayuki KUSUNOKI
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2014-262791 20141225
- Main IPC: C08G77/12
- IPC: C08G77/12

Abstract:
A curable silicone resin composition including: (A) an organopolysiloxane having at least two alkenyl groups per molecule, each bonded to a silicone atom and showing a viscosity of 10 to 1,000,000 mPa·s at 25 degrees C., and (B) an organopolysiloxane having a resin structure composed of 10 to 80 mol % of SiO4/2 unit, 0.1 to 80 mol % of (R1)2SiO2/2 unit and 1 to 60 mol % of (R2)3SiO1/2 unit and having a weight average molecular weight of 1,000 to 10,000. R1 represents an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, and R2 represents, independently of each other, an alkenyl group having 2 to 8 carbon atoms, or a substituted or unsubstituted, monovalent hydrocarbon group having no aliphatic unsaturated group, provided that at least one among all of R2 is an alkenyl group.
Public/Granted literature
- US10077338B2 Curable silicone resin composition Public/Granted day:2018-09-18
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