Invention Application
- Patent Title: Air Trench in Packages Incorporating Hybrid Bonding
- Patent Title (中): 封装中的空气沟槽并入混合接合
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Application No.: US15042268Application Date: 2016-02-12
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Publication No.: US20160163684A1Publication Date: 2016-06-09
- Inventor: Bruce C.S. Chou , Chen-Jong Wang , Ping-Yin Liu , Jung-Kuo Tu , Tsung-Te Chou , Xin-Hua Huang , Hsun-Chung Kuang , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L21/308 ; H01L23/00 ; H01L21/764
Abstract:
A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.
Public/Granted literature
- US09502396B2 Air trench in packages incorporating hybrid bonding Public/Granted day:2016-11-22
Information query
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