An outdoor light emitting diode (LED) luminaire includes a plastic housing having two or more surfaces, a printed circuit board (PCB) coupled to at least one of the two or more surfaces, the PCB including a substrate and a conductive surface on the substrate, a plurality of LED light sources mounted on the PCB, a first portion of the conductive surface forming conductive paths in electrical communication with the plurality of LED light sources, and a second portion of the conductive surface forming thermal pads at a plurality of locations that are at least one of between and around the plurality of LED light sources, the thermal pads configured to dissipate heat generated by the plurality of LED light sources.