Aspects of the methods and apparatuses herein involve applying fluids onto an advancing substrate. The apparatuses and methods herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The slot die applicator may include a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip. And the substrate carrier may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, when a first surface of the substrate is disposed on the substrate carrier, the substrate carrier advances a second surface of the substrate past the slot opening of the slot die applicator.