Invention Application
- Patent Title: Interconnect Crack Arrestor Structure and Methods
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Application No.: US14987491Application Date: 2016-01-04
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Publication No.: US20160118351A1Publication Date: 2016-04-28
- Inventor: Chen-Hua Yu , Da-Yuan Shih
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A system and method for preventing cracks is provided. An embodiment comprises placing crack stoppers into a connection between a semiconductor die and a substrate. The crack stoppers may be in the shape of hollow or solid cylinders and may be placed so as to prevent any cracks from propagating through the crack stoppers.
Public/Granted literature
- US10340226B2 Interconnect crack arrestor structure and methods Public/Granted day:2019-07-02
Information query
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