Invention Application
- Patent Title: WAFER DIE SEPARATION
- Patent Title (中): 烘干机分离
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Application No.: US14985705Application Date: 2015-12-31
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Publication No.: US20160118300A1Publication Date: 2016-04-28
- Inventor: Genki Yano
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/687 ; H01L21/683
Abstract:
A method of singulating a wafer starts with fracturing the wafer. The method may also include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching support tape to the ring frame and the dicing tape sheet.
Public/Granted literature
- US09543206B2 Wafer die separation Public/Granted day:2017-01-10
Information query
IPC分类:
