Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14976491Application Date: 2015-12-21
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Publication No.: US20160111391A1Publication Date: 2016-04-21
- Inventor: Jong Sik Paek , Doo Hyun Park
- Applicant: Amkor Technology, Inc.
- Priority: KR10-2012-0129646 20121115
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/48 ; H01L23/31
Abstract:
Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness.
Public/Granted literature
- US09406638B2 Semiconductor device and manufacturing method thereof Public/Granted day:2016-08-02
Information query
IPC分类:
