Invention Application
US20160099373A1 WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME
审中-公开
水平包装,光学检测传感器及其形成方法
- Patent Title: WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME
- Patent Title (中): 水平包装,光学检测传感器及其形成方法
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Application No.: US14968359Application Date: 2015-12-14
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Publication No.: US20160099373A1Publication Date: 2016-04-07
- Inventor: Yonggang Jin , Wee Chin Judy Lim
- Applicant: STMicroelectronics Pte Ltd
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd
- Current Assignee: STMicroelectronics Pte Ltd
- Current Assignee Address: SG Singapore
- Main IPC: H01L31/16
- IPC: H01L31/16 ; H01L31/18 ; H01L31/0232 ; H01L25/16

Abstract:
An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
Public/Granted literature
- US09991409B2 Wafer level packaging, optical detection sensor and method of forming same Public/Granted day:2018-06-05
Information query
IPC分类: