Invention Application
US20150367310A1 COMBINED FIELD ASSISTED SINTERING TECHNIQUES AND HTHP SINTERING TECHNIQUES FOR FORMING POLYCRYSTALLINE DIAMOND COMPACTS AND EARTH-BORING TOOLS 审中-公开
用于形成多晶金刚石复合材料和接地工具的组合现场辅助烧结技术和HTHP烧结技术

  • Patent Title: COMBINED FIELD ASSISTED SINTERING TECHNIQUES AND HTHP SINTERING TECHNIQUES FOR FORMING POLYCRYSTALLINE DIAMOND COMPACTS AND EARTH-BORING TOOLS
  • Patent Title (中): 用于形成多晶金刚石复合材料和接地工具的组合现场辅助烧结技术和HTHP烧结技术
  • Application No.: US14837747
    Application Date: 2015-08-27
  • Publication No.: US20150367310A1
    Publication Date: 2015-12-24
  • Inventor: Anthony A. DiGiovanniDanny E. ScottYavuz Kadioglu
  • Applicant: Baker Hughes Incorporated
  • Main IPC: B01J3/06
  • IPC: B01J3/06
COMBINED FIELD ASSISTED SINTERING TECHNIQUES AND HTHP SINTERING TECHNIQUES FOR FORMING POLYCRYSTALLINE DIAMOND COMPACTS AND EARTH-BORING TOOLS
Abstract:
Methods of forming polycrystalline diamond compacts include employing field assisted sintering techniques with high temperature and high pressure sintering techniques. For example, a particle mixture that includes diamond particles may be sintered by subjecting the particle mixture to a high temperature and high pressure sintering cycle, and pulsing direct electrical current through the particle mixture during at least a portion of the high temperature and high pressure sintering cycle. The polycrystalline diamond compacts may be used to form cutting elements for earth-boring tools. Sintering systems are configured to perform such sintering processes.
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